Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170517 | Method for forming image sensor device | Yueh-Chuan Lee, Ta-Hsin Chen, Chih-Huang Li, Ren-Jie Lin, Jung-I Lin | 2019-01-01 |
| 10163952 | Backside illuminated image sensor device structure | Yueh-Chuan Lee, Chih-Huang Li, Ta-Hsin Chen | 2018-12-25 |
| 10014269 | Method for wafer dicing | Yueh-Chuan Lee | 2018-07-03 |
| 9859325 | Complementary metal-oxide-semiconductor (CMOS) image sensor with silicon and silicon germanium | Yueh-Chuan Lee, Jhy-Jyi Sze | 2018-01-02 |
| 9761623 | Backside illuminated (BSI) image sensor with a reflector | Yueh-Chuan Lee | 2017-09-12 |
| 9748187 | Wafer structure and method for wafer dicing | Yueh-Chuan Lee | 2017-08-29 |
| 9748150 | Test line structure and method for performing wafer acceptance test | Yueh-Chuan Lee, Ping-Chieh Chin | 2017-08-29 |
| 9257463 | Self-aligned implantation process for forming junction isolation regions | Chien-Hsien Tseng, Shou-Gwo Wuu, Kuo-Yu Wu, Dao-Hong Yang, Ming-Hao Chung | 2016-02-09 |