Issued Patents All Time
Showing 176–200 of 209 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7651960 | Chemical vapor deposition method preventing particles forming in chamber | Neng-Kuo Chen, Hsiu-Lien Liao | 2010-01-26 |
| 7645712 | Method of forming contact | Neng-Kuo Chen, Chien-Chung Huang | 2010-01-12 |
| 7642166 | Method of forming metal-oxide-semiconductor transistors | Kun-Hsien Lee, Cheng-Tung Huang, Wen-Han Hung, Shyh-Fann Ting, Li-Shian Jeng +4 more | 2010-01-05 |
| 7588883 | Method for forming a gate and etching a conductive layer | Neng-Kuo Chen, Hsiu-Lien Liao | 2009-09-15 |
| 7566668 | Method of forming contact | Neng-Kuo Chen, Chien-Chung Huang | 2009-07-28 |
| 7544603 | Method of fabricating silicon nitride layer and method of fabricating semiconductor device | Neng-Kuo Chen, Hsiu-Lien Liao | 2009-06-09 |
| 7544305 | Chemical mechanical polishing process for forming shallow trench isolation structure | Chia-Jung Hsu, Art Yu, Hsiao-Ling Lu | 2009-06-09 |
| 7541298 | STI of a semiconductor device and fabrication method thereof | Shao-Ta Hsu, Neng-Kuo Chen | 2009-06-02 |
| 7494878 | Metal-oxide-semiconductor transistor and method of forming the same | Kun-Hsien Lee, Cheng-Tung Huang, Wen-Han Hung, Shyh-Fann Ting, Li-Shian Jeng +4 more | 2009-02-24 |
| 7485515 | Method of manufacturing metal oxide semiconductor | Neng-Kuo Chen, Chien-Chung Huang | 2009-02-03 |
| 7332447 | Method of forming a contact | Neng-Kuo Chen, Chien-Chung Huang | 2008-02-19 |
| 7294572 | Method of forming contact | Chao-Lon Yang, Neng-Kuo Chen, Chien-Chung Huang, Shao-Ta Hsu | 2007-11-13 |
| 7294575 | Chemical mechanical polishing process for forming shallow trench isolation structure | Chia-Rung Hsu, Art Yu, Hsiao-Ling Lu | 2007-11-13 |
| 7238586 | Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition technique | Shao-Ta Hsu, Neng-Kuo Chen | 2007-07-03 |
| 7232752 | Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation | Shao-Chung Hu, Chia-Lin Hsu, Yung-Tsung Wei | 2007-06-19 |
| 7172970 | Polish method for semiconductor device planarization | Zong-Huei Lin, Art Yu, Chia-Rung Hsu | 2007-02-06 |
| 7025661 | Chemical mechanical polishing process | Chia-Lin Hsu | 2006-04-11 |
| 6989337 | Silicon oxide gap-filling process | Hsiu-Chuan Chu, Chih-An Huang, Neng-Kuo Chen | 2006-01-24 |
| 6913978 | Method for forming shallow trench isolation structure | Neng-Kuo Chen, Hsiu-Chuan Chu, Chih-An Huang, Hsiao-Ling Lu | 2005-07-05 |
| 6831013 | Method of forming a dual damascene via by using a metal hard mask layer | Chia-Lin Hsu | 2004-12-14 |
| 6706140 | Control system for in-situ feeding back a polish profile | Chia-Lin Hsu, Shao-Chung Hu | 2004-03-16 |
| 6696361 | Post-CMP removal of surface contaminants from silicon wafer | Shao-Chung Hu, Chia-Lin Hsu, Yung-Tsung Wei | 2004-02-24 |
| 6638830 | Method for fabricating a high-density capacitor | Chia-Lin Hsu, Yi-Fang Cheng | 2003-10-28 |
| 6616510 | Chemical mechanical polishing method for copper | Chia-Lin Hsu, Yung-Tsung Wei, Ming-Sheng Yang | 2003-09-09 |
| 6593185 | Method of forming embedded capacitor structure applied to logic integrated circuit | Chia-Lin Hsu, Yi-Fang Cheng, Yi-Hsiung Lin | 2003-07-15 |