Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9687956 | Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith | Shi Cheng, Kun-Shu Yang, Jia-Cheng Hsu, Sheng-Huan Liu, Feng-Chih Hsu +1 more | 2017-06-27 |
| 9409276 | CMP polishing pad having edge exclusion region of offset concentric groove pattern | Shi Cheng, Jia-Cheng Hsu, Kun-Shu Yang, Hui Feng Chen, Gregory T. Gaudet +1 more | 2016-08-09 |
| RE45468 | Barrier-slurry-free copper CMP process | Yi-Chen Chen, Ray-Ting Chang | 2015-04-14 |
| 6830504 | Barrier-slurry-free copper CMP process | Yi-Chen Chen, Ray-Ting Chang | 2004-12-14 |
| 6756309 | Feed forward process control method for adjusting metal line Rs | Chii-Ping Chen, Wen-Chen Chien | 2004-06-29 |