Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881996 | Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer | Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Yen-Shih Ho, Kuo-Reay Peng +2 more | 2005-04-19 |
| 6812088 | Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer | Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Yen-Shih Ho, Kuo-Reay Peng +2 more | 2004-11-02 |
| 6472721 | Dual damascene interconnect structures that include radio frequency capacitors and inductors | Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2002-10-29 |
| 6329234 | Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow | Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more | 2001-12-11 |