Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7338819 | System and method for matching chip and package terminals | Yung-Wen Wu | 2008-03-04 | $5,251,000 |
| 5878053 | Hierarchial power network simulation and analysis tool for reliability testing of deep submicron IC designs | Han Young Koh, Jeh-Fu Tuan, Tak K. Young, Hurley Song | 1999-03-02 | $42,070,000 |