Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953991 | Semiconductor device | Kozo Sato | 2005-10-11 |
| 6917143 | Lighting apparatus with enhanced capability of removing heat | Nobuyuki Matsui, Hideo Nagai, Tetsushi Tamura | 2005-07-12 |
| 6883933 | Lighting apparatus whose light emitting elements are hard to be taken off | Nobuyuki Matsui, Hideo Nagai, Tetsushi Tamura | 2005-04-26 |
| 6492255 | Semiconductor chip and method manufacturing the same | Ryo Enomoto, Hideo Yabashi, Tadashi Sugiyama | 2002-12-10 |
| 5998866 | Semiconductor device having a lead clamping arrangement | Takao Ochi, Hisashi Funakoshi, Takashi Wakabayashi | 1999-12-07 |
| 5796714 | Optical module having a vertical-cavity surface-emitting laser | Toyoji Chino, Kenichi Matsuda, Takayuki Yoshida | 1998-08-18 |
| 5783463 | Semiconductor device and method of producing said semiconductor device | Shinitsu Takehashi | 1998-07-21 |
| 5776802 | Semiconductor device and manufacturing method of the same | Takao Ochi, Hisashi Funakoshi, Takashi Wakabayashi | 1998-07-07 |
| 5739053 | Process for bonding a semiconductor to a circuit substrate including a solder bump transferring step | Tetuo Kawakita | 1998-04-14 |
| 5665610 | Semiconductor device checking method | Yoshiro Nakata, Shinichi Oki, Koichi Nagao, Shigeoki Mori, Takashi Sato +1 more | 1997-09-09 |
| 5640044 | Semiconductor device and method of producing said semiconductor device | Shinitsu Takehashi | 1997-06-17 |
| 5477087 | Bump electrode for connecting electronic components | Tetsuo Kawakita | 1995-12-19 |
| 5336547 | Electronic components mounting/connecting package and its fabrication method | Tetsuo Kawakita, Takayuki Yoshida | 1994-08-09 |
| 5316204 | Method for bonding lead with electrode of electronic device | Shinitsu Takehashi, Hiroaki Fujimoto | 1994-05-31 |
| 5316610 | Bonding apparatus | Tomohiro Tamaki, Hiroaki Fujimoto, Yoshinobu Takeshita | 1994-05-31 |
| 5233426 | Reduced diameter camera head for solid-state image pickup device and method of producing same | Takahisa Suzuki, Tatsuki Tsukada | 1993-08-03 |
| 5115545 | Apparatus for connecting semiconductor devices to wiring boards | Hiroaki Fujimoto, Yoshinobu Takeshita, Kazuya Otani, Kimiaki Takeda | 1992-05-26 |
| 5089772 | Device for testing semiconductor integrated circuits and method of testing the same | Takeshi Ishihara, Nobuaki Suzuki, Satowaka Kuroda | 1992-02-18 |
| 5089750 | Lead connection structure | Koichi Nagao | 1992-02-18 |
| 5012969 | Method of connecting electrodes | Hiroaki Fujimoto | 1991-05-07 |
| 4996583 | Stack type semiconductor package | — | 1991-02-26 |
| 4959590 | Lead connection structure | Koichi Nagao | 1990-09-25 |
| 4876221 | Bonding method | — | 1989-10-24 |
| 4784972 | Method of joining beam leads with projections to device electrodes | — | 1988-11-15 |
| 4766426 | Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted | Koji Matsunaga | 1988-08-23 |