Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Daisuke HIEDA — 2 Patents

SUSumco: 2 patents #160 of 464Top 35%
Tokyo, JP: #44,108 of 90,295 inventorsTop 50%
Overall (All Time): #1,709,992 of 4,157,543Top 45%
2 Patents All Time
Daisuke HIEDA has been granted 2 US patents while listed as an inventor at Sumco. The first was granted in 2019 and the most recent in August 2025. Daisuke HIEDA ranks #1,709,992 of 4,157,543 US inventors in our database (top 41.1%). Patent records list Daisuke HIEDA in Tokyo, JP.

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12400909 Method for producing support substrate for bonded wafer, and support substrate for bonded wafer Naoya NONAKA, Hiroaki ISHIZAKI, Toshiyuki Isami, Koudai Moroiwa 2025-08-26
10490437 Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer Hisashi Uchino, Tatsuo Kusumoto 2019-11-26