Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400909 | Method for producing support substrate for bonded wafer, and support substrate for bonded wafer | Naoya NONAKA, Daisuke HIEDA, Hiroaki ISHIZAKI, Toshiyuki Isami | 2025-08-26 |
| 8662961 | Polishing pad seasoning method, seasoning plate, and semiconductor polishing device | Daisuke Maruoka | 2014-03-04 |