Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8203145 | Structure for bumped wafer test | Byung Tai Do, Lee Huang Chew | 2012-06-19 |
| 7952211 | Semiconductor assembly with component pads attached on die back side | Seng Guan Chow | 2011-05-31 |
| 7901956 | Structure for bumped wafer test | Byung Tai Do, Lee Huang Chew | 2011-03-08 |
| 7858442 | Leaded stacked packages having elevated die paddle | Byung Tai Do, Seng Guan Chow | 2010-12-28 |
| 7667308 | Leaded stacked packages having integrated upper lead | Byung Tai Do, Seng Guan Chow | 2010-02-23 |
| 7622811 | Semiconductor assembly with component attached on die back side | Seng Guan Chow | 2009-11-24 |
| 7495321 | Leaded stacked packages having elevated die paddle | Byung Tai Do, Seng Guan Chow | 2009-02-24 |