Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8203145 | Structure for bumped wafer test | Francis Heap Hoe Kuan, Byung Tai Do | 2012-06-19 |
| 7901956 | Structure for bumped wafer test | Francis Heap Hoe Kuan, Byung Tai Do | 2011-03-08 |