Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11800249 | Imaging device for connection with a circuit element | Yuta Momiuchi | 2023-10-24 |
| 11676977 | Semiconductor device | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2023-06-13 |
| 11356584 | Camera module, production method, and electronic device | Yuta Momiuchi, Hirokazu Nakayama, Kiyohisa Tanaka, Miyoshi Togawa, Hirokazu Seki | 2022-06-07 |
| 11315970 | Semiconductor device and method of manufacturing the same | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2022-04-26 |
| 11245863 | Imaging device for connection with a circuit element | Yuta Momiuchi | 2022-02-08 |
| 11239529 | Film production method | Akihiko SHIN, Atsushi Nakazawa, Hideyuki Sasaki | 2022-02-01 |
| 11171170 | Image sensor package with flexible printed circuits | Yuta Momiuchi, Kiyohisa Tanaka, Eiichirou Kishida, Emi Nishioka, Naoki Yamashita +1 more | 2021-11-09 |
| 10867950 | Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device | Makoto Murai | 2020-12-15 |
| 10720402 | Semiconductor device and method of manufacturing the same | Makoto Murai, Kazuki Sato, Hiroyuki Yamada, Makoto Imai, Shigeki Amano | 2020-07-21 |
| 10720459 | Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients | Yuta Momiuchi, Hirokazu Nakayama, Kiyohisa Tanaka, Miyoshi Togawa, Hirokazu Seki +1 more | 2020-07-21 |
| 10418340 | Semiconductor chip mounted on a packaging substrate | Makoto Murai, Kazuki Sato, Hiroyuki Yamada | 2019-09-17 |
| 10050074 | Semiconductor device and method of manufacturing the same | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2018-08-14 |
| 10014248 | Semiconductor device with less positional deviation between aperture and solder | Makoto Murai, Hiroyuki Yamada, Kazuki Sato, Makoto Imai | 2018-07-03 |
| 9379155 | Semiconductor device and method of manufacturing the same | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2016-06-28 |
| 9041179 | Semiconductor device and method of manufacturing the same | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2015-05-26 |
| 8564101 | Semiconductor apparatus having a through-hole interconnection | Yoshimichi Harada, Masami Suzuki, Yoshihiro Nabe, Tatsuo Suemasu, Hideyuki Wada +1 more | 2013-10-22 |
| 8273657 | Method for manufacturing a semiconductor apparatus having a through-hole interconnection | Yoshimichi Harada, Masami Suzuki, Yoshihiro Nabe, Tatsuo Suemasu, Hideyuki Wada +1 more | 2012-09-25 |
| 8252628 | Semiconductor device and method of manufacturing the same | Yoshihiro Nabe, Hiroshi Asami, Yoshimichi Harada | 2012-08-28 |
| 7851880 | Solid-state imaging device | Masami Suzuki, Yoshimichi Harada, Yoshihiro Nabe, Masaaki Takizawa, Chiaki Sakai | 2010-12-14 |
| 7402901 | Semiconductor device and method of manufacturing semiconductor device | Masaki Hatano | 2008-07-22 |
| 7135378 | Process for fabricating a semiconductor device having a plurality of encrusted semiconductor chips | Yukihiro Kamide, Teruo Hirayama, Masaki Hatano | 2006-11-14 |
| 7064005 | Semiconductor apparatus and method of manufacturing same | — | 2006-06-20 |
| 6936525 | Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof | Kazuo Nishiyama, Hiroshi Ozaki, Teruo Hirayama | 2005-08-30 |
| 6466723 | Cleaning tool for optical fiber connectors | Taisei Miyake, Ai Fukuhara, Juichi Noda, Etsuji Sugita, Hitoshi Goto +2 more | 2002-10-15 |
| 5827436 | Method for etching aluminum metal films | Yukihiro Kamide, Yasuaki Yamamichi | 1998-10-27 |