Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8652419 | Method of manufacturing microfluidic chip, microfluidic chip, and apparatus for generating surface plasmon resonant light | Satoshi Yamamoto | 2014-02-18 |
| 8564101 | Semiconductor apparatus having a through-hole interconnection | Yoshimichi Harada, Masami Suzuki, Yoshihiro Nabe, Yuji Takaoka, Hideyuki Wada +1 more | 2013-10-22 |
| 8273657 | Method for manufacturing a semiconductor apparatus having a through-hole interconnection | Yoshimichi Harada, Masami Suzuki, Yoshihiro Nabe, Yuji Takaoka, Hideyuki Wada +1 more | 2012-09-25 |
| 7814651 | Method for fabricating a through-hole interconnection substrate | Takashi Takizawa | 2010-10-19 |
| 7368321 | Semiconductor package and method for manufacturing the same | Michikazu Tomita, Sayaka Hirafune | 2008-05-06 |
| 7274101 | Semiconductor package and method for manufacturing the same | Michikazu Tomita, Sayaka Hirafune | 2007-09-25 |
| 7217890 | Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate | Takashi Takizawa | 2007-05-15 |
| 7180149 | Semiconductor package with through-hole | Satoshi Yamamoto, Sayaka Hirafune, Toshihiko Isokawa, Koichi Shiotani, Kazuya Matsumoto | 2007-02-20 |
| 7080560 | Semiconductor pressure sensor | Takashi Takizawa, Satoshi Yamamoto | 2006-07-25 |
| 7022609 | Manufacturing method of a semiconductor substrate provided with a through hole electrode | Satoshi Yamamoto, Takashi Takizawa, Masahiro Katashiro, Hiroshi Miyajima, Kazuya Matsumoto +1 more | 2006-04-04 |
| 6743499 | Metal filling method and member with filled metal sections | Takashi Takizawa | 2004-06-01 |