Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11356584 | Camera module, production method, and electronic device | Yuta Momiuchi, Yuji Takaoka, Hirokazu Nakayama, Kiyohisa Tanaka, Hirokazu Seki | 2022-06-07 |
| 11211300 | Electronic component and camera module | Ryo Itotani, Yuta Momiuchi, Hirokazu Nakayama, Tooru Kai | 2021-12-28 |
| 11178759 | Electronic component and camera module | Ryo Itotani, Yuta Momiuchi, Hirokazu Nakayama, Tooru Kai | 2021-11-16 |
| 10917550 | Electronic component, camera module, and method for manufacturing electronic component | Yuta Momiuchi, Ryo Itotani, Hirokazu Nakayama, Tooru Kai | 2021-02-09 |
| 10720459 | Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients | Yuta Momiuchi, Yuji Takaoka, Hirokazu Nakayama, Kiyohisa Tanaka, Hirokazu Seki +1 more | 2020-07-21 |
| 7129578 | Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body | — | 2006-10-31 |
| 6121686 | Ball grid array package having through-holes disposed in the substrate under the chip | — | 2000-09-19 |