Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5877078 | Method of manufacturing a semiconductor device | — | 1999-03-02 |
| 5866475 | Method of forming solder bumps | — | 1999-02-02 |
| 5726097 | Method of forming multilevel interconnections using high density plasma metal clean | — | 1998-03-10 |
| 5591302 | Process for etching copper containing metallic film and for forming copper containing metallic wiring | Keiji Shinohara, Junichi Sato, Yukihiro Kamide | 1997-01-07 |
| 5569627 | Process for etching copper containing metallic film and for forming copper containing metallic wiring | Keiji Shinohara, Junichi Sato, Yukihiro Kamide | 1996-10-29 |
| 5505322 | Process for etching copper containing metallic film and forming copper containing metallic wiring | Keiji Shinohara, Junichi Sato, Yukihiro Kamide | 1996-04-09 |
| 5445712 | Dry etching method | — | 1995-08-29 |
| 5419809 | Dry etching method | Tetsuji Nagayama | 1995-05-30 |
| 5378653 | Method of forming aluminum based pattern | — | 1995-01-03 |
| 5376228 | Dry etching method | — | 1994-12-27 |
| 5376234 | Dry etching method | — | 1994-12-27 |
| 5362350 | Method for etching in dry process | — | 1994-11-08 |
| 5338399 | Dry etching method | — | 1994-08-16 |
| 5314575 | Etching method and apparatus | — | 1994-05-24 |
| 5160398 | Etching method and apparatus | — | 1992-11-03 |