Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7420273 | Thinned die integrated circuit package | Johanna M. Swan, Chuan Hu, Steven Towle | 2008-09-02 |
| 7295707 | Method for aligning gesture features of image | Chin-Chen Chang, I-Yen Chen | 2007-11-13 |
| 7291863 | Light emitting diode structure | Yuan-Tai Lai, Shen-Jie Wang | 2007-11-06 |
| 7265389 | Light emitting diode and fabricating method thereof | Yuan-Tai Lai, Shen-Jie Wang | 2007-09-04 |
| 6996272 | Apparatus and method for removing background on visual | Jiann-Jone Chen, Jau-Fu Liu, I-Yen Chen | 2006-02-07 |
| 6841413 | Thinned die integrated circuit package | Johanna M. Swan, Steven Towle | 2005-01-11 |
| 6744142 | Flip chip interconnection structure and process of making the same | Shen-Jie Wang, Cheng-Heng Kao | 2004-06-01 |
| 6642079 | Process of fabricating flip chip interconnection structure | Shen-Jie Wang, Cheng-Heng Kao | 2003-11-04 |