Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784100 | Method of manufacturing a molded flip chip package to facilitate electrical testing | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2023-10-10 |
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2021-11-16 |
| 8298865 | Method for manufacturing a substrate for a semiconductor package | Young Berm JUNG, Hong Bum Park, Young Geon Kwon, Seong Kwon Chin, Seok Koo Jung | 2012-10-30 |
| 8125086 | Substrate for semiconductor package | Young Berm JUNG, Hong Bum Park, Young Geon Kwon, Seong Kwon Chin, Seok Koo Jung | 2012-02-28 |