Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8298865 | Method for manufacturing a substrate for a semiconductor package | Young Berm JUNG, Hong Bum Park, Young Geon Kwon, Byeung Ho Kim, Seok Koo Jung | 2012-10-30 |
| 8125086 | Substrate for semiconductor package | Young Berm JUNG, Hong Bum Park, Young Geon Kwon, Byeung Ho Kim, Seok Koo Jung | 2012-02-28 |