Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209161 | Stacked package and method for manufacturing the same | — | 2015-12-08 |
| 8298865 | Method for manufacturing a substrate for a semiconductor package | Hong Bum Park, Young Geon Kwon, Seong Kwon Chin, Byeung Ho Kim, Seok Koo Jung | 2012-10-30 |
| 8125086 | Substrate for semiconductor package | Hong Bum Park, Young Geon Kwon, Seong Kwon Chin, Byeung Ho Kim, Seok Koo Jung | 2012-02-28 |