Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784100 | Method of manufacturing a molded flip chip package to facilitate electrical testing | Dong Jin Kim, Byeung Ho Kim, Chang Hyun Kim | 2023-10-10 |
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Dong Jin Kim, Byeung Ho Kim, Chang Hyun Kim | 2021-11-16 |