Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872867 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chihon Ho | 2020-12-22 |
| 10872868 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chihon Ho | 2020-12-22 |
| 10854951 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2020-12-01 |
| 10854476 | Semiconductor vertical wire bonding structure and method | Han-Min Huang, Chengchung Lin, Yenheng Chen | 2020-12-01 |
| 10804229 | Fan-out antenna package structure and packaging method | Yenheng Chen, Chengchung Lin | 2020-10-13 |
| 10777876 | Antenna feeder package structure and packaging method | Jangshen Lin, Yenheng Chen, Chengchung Lin | 2020-09-15 |
| 10777515 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chihon Ho | 2020-09-15 |
| 10777516 | Fan-out antenna packaging structure and packaging method | Yenheng Chen, Chengchung Lin | 2020-09-15 |
| 10770394 | Fan-out semiconductor packaging structure with antenna module and method making the same | Yenheng Chen, Jangshen Lin, Chengchung Lin | 2020-09-08 |
| 10714435 | Fan-out antenna packaging structure and method making the same | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2020-07-14 |
| 10573609 | Fan-out antenna packaging structure and preparation thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2020-02-25 |
| 10325786 | Double-sided plastic fan-out package structure having antenna and manufacturing method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2019-06-18 |