Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6528391 | Controlled cleavage process and device for patterned films | Francois J. Henley | 2003-03-04 |
| 6511899 | Controlled cleavage process using pressurized fluid | Francois J. Henley | 2003-01-28 |
| 6486041 | Method and device for controlled cleaving process | Francois J. Henley | 2002-11-26 |
| 6458672 | Controlled cleavage process and resulting device using beta annealing | Francois J. Henley | 2002-10-01 |
| 6420242 | Separation of thin films from transparent substrates by selective optical processing | Timothy D. Sands, William S. Wong | 2002-07-16 |
| 6391740 | Generic layer transfer methodology by controlled cleavage process | Francois J. Henley | 2002-05-21 |
| 6344404 | Method of separation films from bulk substrates by plasma immersion ion implantation | Xiang Lu, Chenming Hu | 2002-02-05 |
| 6335263 | Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials | Timothy D. Sands, William S. Wong | 2002-01-01 |
| 6335264 | Controlled cleavage thin film separation process using a reusable substrate | Francois J. Henley | 2002-01-01 |
| 6321134 | Clustertool system software using plasma immersion ion implantation | Francois J. Henley | 2001-11-20 |
| 6294814 | Cleaved silicon thin film with rough surface | Francois J. Henley | 2001-09-25 |
| 6291313 | Method and device for controlled cleaving process | Francois J. Henley | 2001-09-18 |
| 6290804 | Controlled cleavage process using patterning | Francois J. Henley | 2001-09-18 |
| 6291314 | Controlled cleavage process and device for patterned films using a release layer | Francois J. Henley | 2001-09-18 |
| 6291326 | Pre-semiconductor process implant and post-process film separation | Francois J. Henley | 2001-09-18 |
| 6284631 | Method and device for controlled cleaving process | Francois J. Henley | 2001-09-04 |
| 6265328 | Wafer edge engineering method and device | Francois J. Henley, William G. Eng, Igor J. Malik | 2001-07-24 |
| 6248649 | Controlled cleavage process and device for patterned films using patterned implants | Francois J. Henley | 2001-06-19 |
| 6245161 | Economical silicon-on-silicon hybrid wafer assembly | Francois J. Henley | 2001-06-12 |
| 6207005 | Cluster tool apparatus using plasma immersion ion implantation | Francois J. Henley | 2001-03-27 |
| 6187110 | Device for patterned films | Francois J. Henley | 2001-02-13 |
| 6184111 | Pre-semiconductor process implant and post-process film separation | Francois J. Henley | 2001-02-06 |
| 6162705 | Controlled cleavage process and resulting device using beta annealing | Francois J. Henley | 2000-12-19 |
| 6159825 | Controlled cleavage thin film separation process using a reusable substrate | Francois J. Henley | 2000-12-12 |
| 6159824 | Silicon-on-silicon wafer bonding process using a thin film blister-separation method | Francois J. Henley | 2000-12-12 |