IY

Isao Yokokawa

SC Shin-Etsu Handotai Co.: 32 patents #14 of 679Top 3%
Overall (All Time): #112,740 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 26–32 of 32 patents

Patent #TitleCo-InventorsDate
6959854 Production method for bonded substrates Masatake Nakano, Kiyoshi Mitani 2005-11-01
6900113 Method for producing bonded wafer and bonded wafer Masatake Nakano, Kiyoshi Mitani 2005-05-31
6566233 Method for manufacturing bonded wafer Kiyoshi Mitani 2003-05-20
6312797 Method for manufacturing bonded wafer and bonded wafer Kiyoshi Mitani 2001-11-06
6306730 Method of fabricating an SOI wafer and SOI wafer fabricated by the method Kiyoshi Mitani 2001-10-23
6284629 Method of fabricating an SOI wafer and SOI wafer fabricated by the method Naoto Tate, Kiyoshi Mitani 2001-09-04
6245645 Method of fabricating an SOI wafer Kiyoshi Mitani 2001-06-12