Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D922329 | Press-fit pin case | Jihwan Kim, Yushuang YAO, Bosung WON, Olaf Zschieschang | 2021-06-15 |
| 10971429 | Method for forming a semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2021-04-06 |
| 10971428 | Semiconductor baseplates | Francis J. Carney, Chee Hiong CHEW, Yushuang YAO | 2021-04-06 |
| 10966335 | Fin frame assemblies | Chee Hiong CHEW, Yushuang YAO | 2021-03-30 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Chee Hiong CHEW, Francis J. Carney, Yusheng LIN | 2021-01-19 |
| 10861775 | Connecting clip design for pressure sintering | Chee Hiong CHEW, Yushuang YAO | 2020-12-08 |
| 10861767 | Package structure with multiple substrates | Chee Hiong CHEW, Yushuang YAO | 2020-12-08 |
| 10825748 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-11-03 |
| 10720725 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-07-21 |
| 10699989 | Semiconductor package with grounding device and related methods | Sw Wang, Kai Chat Tan | 2020-06-30 |
| 10693270 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Yusheng LIN | 2020-06-23 |
| 10607921 | Method for forming a semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10607920 | Semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10559905 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2020-02-11 |
| 10319659 | Semiconductor package and related methods | C H Chew, Yushuang YAO | 2019-06-11 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Chee Hiong CHEW, Francis J. Carney, Yusheng LIN | 2019-03-12 |
| 10224655 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2019-03-05 |
| 10177074 | Flexible semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2019-01-08 |
| 10121763 | Clip and related methods | Chee Hiong CHEW, Yushuang YAO | 2018-11-06 |
| 10056317 | Semiconductor package with grounding device and related methods | Sw Wang, Kai Chat Tan | 2018-08-21 |
| 9967986 | Semiconductor package and method therefor | Chee Hiong CHEW, Yushuang YAO | 2018-05-08 |
| 9911712 | Clip and related methods | Chee Hiong CHEW, Yushuang YAO | 2018-03-06 |
| 9620877 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2017-04-11 |
| 9570832 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Yusheng LIN | 2017-02-14 |
| D755742 | Power device package | Chee Hiong CHEW, Yushuang YAO | 2016-05-10 |