Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427446 | Liquid supplying unit and liquid supplying method | Jung Suk GOH, Kuk Saeng KIM, Wan Hee JEONG | 2025-09-30 |
| 12390842 | Supporting structure, apparatus for supporting substrate and facility for processing substrate | Jae Hun JEONG, Cheol Shin, Wan Hee JEONG | 2025-08-19 |
| 12334381 | Guide unit, transfer assembly and die bonding apparatus including the same | Yeon Hyuk Jung, Eung Seok Kim, Byoung Ho Jung | 2025-06-17 |
| 12322614 | Wafer expander for uniformly expanding gap between dies, and die supplying module and die bonding equipment including same | Kuk Saeng KIM, Wan Hee JEONG | 2025-06-03 |
| 12227373 | Article transport vehicle, rail assembly, and article transport system including the same | Wan Hee JEONG, Kuk Saeng KIM, Noh Hoon Myoung | 2025-02-18 |
| 11495467 | Method and apparatus for etching thin layer | Jung Suk GOH, Jae Seong LEE, Kuk Saeng KIM, Young Dae CHUNG, Tae Shin KIM +12 more | 2022-11-08 |
| 10529594 | Apparatus and method for treating substrate | Joonho Won, Kisang Eum, Boong Kim, Joo Jib Park | 2020-01-07 |