Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334381 | Guide unit, transfer assembly and die bonding apparatus including the same | Do Youn LIM, Yeon Hyuk Jung, Eung Seok Kim | 2025-06-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334381 | Guide unit, transfer assembly and die bonding apparatus including the same | Do Youn LIM, Yeon Hyuk Jung, Eung Seok Kim | 2025-06-17 |