Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139576 | Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board | Yuta Oatari, Kohei Takeda, Masami Shindo, Takashi Shinjo, Yuko Kawahara +2 more | 2024-11-12 |
| 11802177 | Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent | Kohei Takeda, Yuta Oatari, Takashi Shinjo, Masami Shindo | 2023-10-31 |
| 11421107 | Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board | Kohei Takeda, Yuta Oatari, Takashi Shinjo, Masami Shindo | 2022-08-23 |
| 11101052 | Conductive material, connection structure and method for producing connection structure | Hidefumi Yasui, Shuujirou Sadanaga, Masahiro Itou, Shike Sou, Yuta Yamanaka | 2021-08-24 |
| 9748195 | Adhesive for mounting flip chip for use in a method for producing a semiconductor device | Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga | 2017-08-29 |
| 9209155 | Method for manufacturing semiconductor device and adhesive for mounting flip chip | Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga | 2015-12-08 |
| 8692394 | Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device | Yangsoo Lee, Atsushi Nakayama, Carl Alvin Dilao | 2014-04-08 |