Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748195 | Adhesive for mounting flip chip for use in a method for producing a semiconductor device | Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura | 2017-08-29 |
| 9209155 | Method for manufacturing semiconductor device and adhesive for mounting flip chip | Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura | 2015-12-08 |
| 9011629 | Adhesive for electronic components, and manufacturing method for semiconductor chip mount | Carl Alvin Dilao, Akinobu Hayakawa, Munehiro Hatai | 2015-04-21 |