Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139576 | Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board | Sayaka Wakioka, Kohei Takeda, Masami Shindo, Takashi Shinjo, Yuko Kawahara +2 more | 2024-11-12 |
| 11802177 | Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent | Kohei Takeda, Sayaka Wakioka, Takashi Shinjo, Masami Shindo | 2023-10-31 |
| 11421107 | Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board | Sayaka Wakioka, Kohei Takeda, Takashi Shinjo, Masami Shindo | 2022-08-23 |