Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139576 | Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board | Sayaka Wakioka, Yuta Oatari, Kohei Takeda, Takashi Shinjo, Yuko Kawahara +2 more | 2024-11-12 |
| 11802177 | Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent | Kohei Takeda, Sayaka Wakioka, Yuta Oatari, Takashi Shinjo | 2023-10-31 |
| 11421107 | Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board | Sayaka Wakioka, Kohei Takeda, Yuta Oatari, Takashi Shinjo | 2022-08-23 |
| 6521060 | Filler metal for use in welding of Ni-Cr-W alloys | Yuji Kurata, Hirokazu Tsuji, Hajime Nakajima, Teiichiro Saito, Tamao Takatsu | 2003-02-18 |
| 5449490 | Nickel-chromium-tungsten base superalloy | Tatsuo Kondo, Hajime Nakajima, Hirokazu Tsuji, Ryohei Tanaka, Susumi Isobe +2 more | 1995-09-12 |
| 5141704 | Nickel-chromium-tungsten base superalloy | Tatsuo Kondo, Hajime Nakajima, Hirokazu Tsuji, Ryohei Tanaka, Susumu Isobe +2 more | 1992-08-25 |