Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256192 | Fan-out semiconductor package | Moon Hee Yi, Byoung Chan Kim, Jung-Hyun Cho | 2019-04-09 |
| 10242973 | Fan-out-semiconductor package module | Joo Hwan Jung, Young Sik Hur, Jung Chul Gong, Han Kim | 2019-03-26 |
| 10177103 | Fan-out semiconductor package | Moon Hee Yi, Tae-Seong Kim | 2019-01-08 |
| 10153235 | Image sensor device and image sensor module comprising the same | Dae-Kwon Jung, Bang Chul Ko, Chul CHOI, Jung-Hyun Cho, Joo Hwan Jung +1 more | 2018-12-11 |
| 10129982 | Embedded board and method of manufacturing the same | Jae Hoon Choi, Jung-Hyun Park, Hea Sung Kim, Jung-Hyun Cho, Il Jong Seo | 2018-11-13 |
| 10109541 | Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package | Jung-Hyun Cho, Jae Hoon Choi | 2018-10-23 |
| 10096559 | Fan-out semiconductor package | Byoung Chan Kim | 2018-10-09 |
| 10096560 | Fan-out semiconductor package | Byoung Chan Kim | 2018-10-09 |
| 10076038 | Printed circuit board and manufacturing method thereof | Jung-Hyun Park, Jae Hoon Choi | 2018-09-11 |
| 10061967 | Fan-out semiconductor package | Jung-Hyun Cho, Byoung Chan Kim | 2018-08-28 |
| 10045444 | Printed circuit board, package and method of manufacturing the same | Jae Ean LEE, Jee-Soo Mok, Young Gwan Ko, Kyung Hwan Ko | 2018-08-07 |
| 10026678 | Fan-out semiconductor package | Jung-Hyun Cho, Jun Oh Hwang, Joo Hwan Jung, Moon Hee Yi | 2018-07-17 |
| 9999131 | Printed circuit board with embedded electronic component and manufacturing method thereof | Kyung Hwan Ko, Young Gwan Ko, Jae Ean LEE, Jee-Soo Mok | 2018-06-12 |
| 9999141 | Printed circuit board and method for manufacturing the same | Kyung Hwan Ko, Jung-Hyun Cho, Jung-Hyun Park | 2018-06-12 |
| 9894764 | Printed circuit board and method of manufacturing the same | Sung Uk Lee, Il Jong Seo, Jae Hoon Choi | 2018-02-13 |
| 9848492 | Printed circuit board and method of manufacturing the same | Jae Ean LEE, Jee-Soo Mok, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko | 2017-12-19 |
| 9837343 | Chip embedded substrate | Joon-Sung Kim, Jung-Hyun Cho, Eung-Suek Lee, Jae Hoon Choi, Young Gwan Ko | 2017-12-05 |
| 9831142 | Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package | Jung-Hyun Cho, Jae Hoon Choi | 2017-11-28 |
| 9736927 | Printed circuit board and method of manufacturing the same | Suk Hyeon Cho, Yoong Oh, Young Gwan Ko, Young Kuk Ko | 2017-08-15 |
| 9736939 | Printed circuit board and method of manufacturing printed circuit board | Suk Hyeon Cho, Young Gwan Ko, Yoong Oh, Young Kuk Ko | 2017-08-15 |
| 9578749 | Element embedded printed circuit board and method of manufacturing the same | Jung-Hyun Cho, Young Gwan Ko, Jae Hoon Choi, Jung-Hyun Park | 2017-02-21 |
| 8796559 | Lead pin for printed circuit board and printed circuit board using the same | Seok Hyun PARK, Ki Taek Lee | 2014-08-05 |
| 7989582 | Process for producing poly-tetrahydrofuran | Eun-Ku Lee, Joon Seok Oh, No-Hyun Kim, Jae-young Huh | 2011-08-02 |
| 7465816 | Production of tetrahydrofuran from 1,4-butanediol | Eun-Ku Lee | 2008-12-16 |
| 7396945 | Method of preparing tetrahydrofuran | Eun-Ku Lee | 2008-07-08 |