Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205637 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim +2 more | 2021-12-21 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim +2 more | 2020-10-06 |
| 10068878 | Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB | Jin-Gyu Kim, Ji-Sun Hong, Hyun Ki Kim, Hyun-Bae Lee | 2018-09-04 |