Issued Patents All Time
Showing 101–121 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5939787 | Semiconductor device having a multi-layer contact structure | — | 1999-08-17 |
| 5918118 | Dual deposition methods for forming contact metallizations, capacitors, and memory devices | Jin Won Kim, Cheal-Seong Hwang | 1999-06-29 |
| 5892254 | Integrated circuit capacitors including barrier layers having grain boundary filling material | Chang-Soo Park, Hong-ku Paik | 1999-04-06 |
| 5869902 | Semiconductor device and manufacturing method thereof | Chang-Soo Park | 1999-02-09 |
| 5851917 | Method for manufacturing a multi-layer wiring structure of a semiconductor device | — | 1998-12-22 |
| 5846859 | Method for manufacturing a semiconductor memory device having capacitive storage | — | 1998-12-08 |
| 5843842 | Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates | Jeong-in Hong, Jong-Ho Park | 1998-12-01 |
| 5843843 | Method for forming a wiring layer a semiconductor device | Gil-Heyun Choi | 1998-12-01 |
| 5814556 | Method of filling a contact hole in a semiconductor substrate with a metal | Young-Jin Wee, In-seon Park | 1998-09-29 |
| 5723384 | Method for manufacturing a capacitor in a semiconductor device using selective tungsten nitride thin film | Byung-Lyul Park, Jung-Min Ha, Dae-hong Ko | 1998-03-03 |
| 5665659 | Method for forming metal layer of a semiconductor device | Gil-Heyun Choi, Young-Soo Jeon | 1997-09-09 |
| 5589713 | Semiconductor device having an improved wiring layer | Chang-Soo Park | 1996-12-31 |
| 5572071 | Semiconductor device having a multi-layer metallization structure | — | 1996-11-05 |
| 5572072 | Semiconductor device having a multi-layer metallization structure | — | 1996-11-05 |
| 5569961 | Semiconductor device having a multi-layer metallization structure | — | 1996-10-29 |
| 5567987 | Semiconductor device having a multi-layer metallization structure | — | 1996-10-22 |
| 5552341 | Semiconductor device and method for manufacturing the same | — | 1996-09-03 |
| 5534463 | Method for forming a wiring layer | Chang-Soo Park | 1996-07-09 |
| 5355020 | Semiconductor device having a multi-layer metal contact | Jeong-in Hong, Jong-Ho Park | 1994-10-11 |
| 5266521 | Method for forming a planarized composite metal layer in a semiconductor device | Chang-Soo Park, Jeong-ha Son | 1993-11-30 |
| 5229325 | Method for forming metal wirings of semiconductor device | Jong-Ho Park, Deok-Min Lee | 1993-07-20 |