Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837573 | Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus | Junhyung Kim, Joongha Lee, Sangha Park, Sunghyup Kim | 2023-12-05 |
| 11581188 | Substrate bonding apparatus | Junhyung Kim, Minsoo Han, Minwoo Rhee, Inbae Chang | 2023-02-14 |
| 11443965 | Wafer to wafer bonding apparatuses | Hyeonjun Yun, Gwanghee Jo, Jewon Lee, Minsoo Han, Junhyung Kim +1 more | 2022-09-13 |