Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112970 | Substrate transfer apparatus | Daeho Min, Junhyung Kim, Minsoo Han, Mngu Lee | 2024-10-08 |
| 12070903 | 3D printing apparatus and 3D printing method | Jungwoo Cho, Hyunjin Lee, Seungdon Lee, Sujie Kang, Sunwoo PARK +3 more | 2024-08-27 |
| 11581188 | Substrate bonding apparatus | Junhyung Kim, Kyeongbin Lim, Minsoo Han, Inbae Chang | 2023-02-14 |