Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443965 | Wafer to wafer bonding apparatuses | Kyeongbin Lim, Gwanghee Jo, Jewon Lee, Minsoo Han, Junhyung Kim +1 more | 2022-09-13 |
HY
Hyeonjun Yun
Overall (All Time): #2,679,901 of 4,157,543Top 65%
1
Patents All Time