Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | Yeonglm Park, HeeJo Chi | 2016-07-12 |
| 9305897 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2016-04-05 |
| 9190297 | Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures | DaeSik Choi, YeongIm Park | 2015-11-17 |
| 9153476 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | HeeJo Chi, YeongIm Park | 2015-10-06 |
| 8710668 | Integrated circuit packaging system with laser hole and method of manufacture thereof | HeeJo Chi, YeongIm Park | 2014-04-29 |
| 8710634 | Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof | HeeJo Chi, Jae Han Chung, Junwoo Myung, Yeonglm Park | 2014-04-29 |
| 8648469 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2014-02-11 |
| 8426955 | Integrated circuit packaging system with a stack package and method of manufacture thereof | HeeJo Chi, YeongIm Park | 2013-04-23 |
| 8357564 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | HeeJo Chi, YeongIm Park | 2013-01-22 |
| 8008121 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2011-08-30 |