HL

Hyun-Seok Lim

Samsung: 31 patents #3,891 of 75,807Top 6%
LC Lg Innotek Co.: 4 patents #732 of 2,133Top 35%
Overall (All Time): #97,976 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
7199019 Method for forming tungsten contact plug Ji-Soon Park, Eung-Joon Lee, Jung Wook Kim 2007-04-03
7141512 Method of cleaning semiconductor device fabrication apparatus In-su Ha, Yoon-bon Koo, Cheon-su Han, Seung-Cheol Choi 2006-11-28
6806135 Method of manufacturing a semiconductor device using a two-step deposition process In-Sun Park, Sang-Bum Kang, Jong-Sik Chun, Seong-Geon Park, In-su Ha 2004-10-19
6590251 Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors Sang-Bom Kang, Yung-sook Chae, In-Sang Jeon, Gil-Heyun Choi 2003-07-08
6399491 Method of manufacturing a barrier metal layer using atomic layer deposition In-Sang Jeon, Sang-Bom Kang, Gil-Heyun Choi 2002-06-04
6391769 Method for forming metal interconnection in semiconductor device and interconnection structure fabricated thereby Jong-Myeong Lee, Byung-Hee Kim, Gil-Heyun Choi, Sang In Lee 2002-05-21
6372598 Method of forming selective metal layer and method of forming capacitor and filling contact hole using the same Sang-Bum Kang, Yun-sook Chae, Sang In Lee, Mee-Young Yoon 2002-04-16
6358829 Semiconductor device fabrication method using an interface control layer to improve a metal interconnection layer Mee-Young Yoon, Sang In Lee 2002-03-19
6348376 Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact and capacitor of semiconductor device using the same Sang-Bom Kang, In-Sang Jeon, Gil-Heyun Choi 2002-02-19
6287965 Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor Sang-Bom Kang, Yung-sook Chae, In-Sang Jeon, Gil-Heyun Choi 2001-09-11