Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7582935 | Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate | Jong Hwan Kim, Mun-heui Choi, Chang-beom Jeong | 2009-09-01 |
| 6878605 | Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate | Jong Hwan Kim, Mun-heui Choi, Chang-beom Jeong | 2005-04-12 |
| 6045892 | Metal wiring structures for integrated circuits including seed layer | Ki Hong Lee | 2000-04-04 |
| 5863375 | Apparatus and methods for wafer debonding using a liquid jet | Byoung Hun Lee | 1999-01-26 |
| 5783022 | Apparatus and methods for wafer debonding using a liquid jet | Byoung Hun Lee | 1998-07-21 |
| 5746883 | Apparatus for bonding semiconductor wafers | Chi-jung Kang, Byung Hun Lee, Kyung Wook Lee | 1998-05-05 |
| 5665631 | SOI substrate manufacturing method | Byoung Hun Lee, Chi-jung Kang, Kyung Wook Lee | 1997-09-09 |