Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5746883 | Apparatus for bonding semiconductor wafers | Gi-ho Cha, Byung Hun Lee, Kyung Wook Lee | 1998-05-05 |
| 5665631 | SOI substrate manufacturing method | Byoung Hun Lee, Kyung Wook Lee, Gi-ho Cha | 1997-09-09 |