Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021027 | Integrated circuit device having parallel conductive lines with bulging end portion(s) and method of manufacturing the same | Wandon Kim | 2024-06-25 |
| 12014951 | Semi-damascene structure with dielectric hardmask layer | Hoonseok Seo, Taeyong Bae | 2024-06-18 |
| 11488864 | Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia | Taeyong Bae, Hoonseok Seo | 2022-11-01 |
| 9171755 | Methods of manufacturing semiconductor devices including capped metal patterns with air gaps in-between for parasitic capacitance reduction | Jongmin Baek, Dohyoung Kim, Tsukasa Matsuda, YoungWoo Cho, Jongseo Hong | 2015-10-27 |