Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014965 | Three-dimensional packaging structure and method for fan-out of bonding wall of device | — | 2024-06-18 |
| 10559525 | Embedded silicon substrate fan-out type 3D packaging structure | — | 2020-02-11 |
| 9368376 | Mechanical debonding method and system | Feng Jiang | 2016-06-14 |
| 9293368 | Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing | Kai Xue | 2016-03-22 |