Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508577 | Semiconductor manufacturing apparatuses comprising bonding heads | Byung Joon LEE, Masato KAJINAMI, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim +3 more | 2016-11-29 |
| 8911229 | Apparatus for manufacturing a semiconductor package | Tae Yun LEE, Seong Wook Cheong, Sang-jin Choi | 2014-12-16 |