Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340209 | Mixed impedance leads for die packages and method of making the same | Eric A. Sanjuan | 2019-07-02 |
| 9997489 | Coated bond wires for die packages and methods of manufacturing said coated bond wires | Eric A. Sanjuan | 2018-06-12 |
| 9960468 | Metalized molded plastic components for millimeter wave electronics and method for manufacture | Eric A. Sanjuan | 2018-05-01 |
| 9859188 | Heat isolation structures for high bandwidth interconnects | Eric A. Sanjuan | 2018-01-02 |
| 9824997 | Die package with low electromagnetic interference interconnection | Eric A. Sanjuan | 2017-11-21 |
| 9812420 | Die packaging with fully or partially fused dielectric leads | Eric A. Sanjuan | 2017-11-07 |
| 9711479 | Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same | Eric A. Sanjuan | 2017-07-18 |
| 9673137 | Electronic device having a lead with selectively modified electrical properties | Eric A. Sanjuan | 2017-06-06 |
| 9523977 | Barcode menu structure advancement | Sean Fuller | 2016-12-20 |
| 9275961 | Low cost high frequency device package and methods | Eric A. Sanjuan | 2016-03-01 |
| 8839508 | Method of making a high frequency device package | Eric A. Sanjuan | 2014-09-23 |
| 8581113 | Low cost high frequency device package and methods | Eric A. Sanjuan | 2013-11-12 |
| 7520054 | Process of manufacturing high frequency device packages | Eliezer Pasternak, Bance Hom | 2009-04-21 |
| 7305890 | Micro-electromechanical sensor | Art Zias, Phil Mauger, Norm Nystrom, Albert K. Henning | 2007-12-11 |
| 7047814 | Micro-electromechanical sensor | Art Zias, Phil Mauger, Norm Nystrom, Albert K. Henning | 2006-05-23 |
| 6770822 | High frequency device packages and methods | Eliezer Pasternak, Bance Hom | 2004-08-03 |
| 6667549 | Micro circuits with a sculpted ground plane | — | 2003-12-23 |
| 6351996 | Hermetic packaging for semiconductor pressure sensors | Steven S. Nasiri, David William Burns, Janusz Bryzek | 2002-03-05 |
| 6346742 | Chip-scale packaged pressure sensor | Janusz Bryzek, David William Burns, Steven S. Nasiri | 2002-02-12 |
| 6229190 | Compensated semiconductor pressure sensor | Janusz Bryzek, David William Burns, Steven S. Nasiri | 2001-05-08 |
| 6058027 | Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate | Douglas Vargha | 2000-05-02 |
| 6006607 | Piezoresistive pressure sensor with sculpted diaphragm | Janusz Bryzek, David William Burns, Steven S. Nasiri, James B. Starr | 1999-12-28 |
| 5802911 | Semiconductor layer pressure switch | Tokudai Neda | 1998-09-08 |
| 5644086 | Preloaded linear beam vibration sensor | Walter Snoeys, Kenichi Nakamura | 1997-07-01 |
| 5629243 | Preloaded linear beam vibration sensor and its manufacturing method | Walter Shoeys, Kenichi Nakamura | 1997-05-13 |