Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325625 | Integrated MEMS electrostatic micro-speaker device and method | Sanjay Bhandari, Ali J. Rastegar | 2025-06-10 |
| 11930321 | Integrated MEMS micro-speaker device and method | Sanjay Bhandari, Ali J. Rastegar | 2024-03-12 |
| 10466119 | Ruggedized wafer level MEMS force sensor with a tolerance trench | Ian Campbell, Ryan Diestelhorst, Dan Benjamin | 2019-11-05 |
| 10288427 | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics | David Sachs, Babak Taheri | 2019-05-14 |
| 9902611 | Miniaturized and ruggedized wafer level MEMs force sensors | Amnon Brosh, Ryan Diestelhorst | 2018-02-27 |
| 9846175 | MEMS rotation sensor with integrated electronics | Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri | 2017-12-19 |
| 9811174 | Interfacing application programs and motion sensors of a device | Joseph Jiang, David Sachs | 2017-11-07 |
| 9751752 | Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2017-09-05 |
| 9533880 | Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2017-01-03 |
| 9342154 | Interfacing application programs and motion sensors of a device | Joseph Jiang, David Sachs | 2016-05-17 |
| 9292102 | Controlling and accessing content using motion processing on mobile devices | David Sachs | 2016-03-22 |
| 9139428 | Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2015-09-22 |
| 8997564 | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics | David Sachs, Babak Taheri | 2015-04-07 |
| 8960002 | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics | Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri | 2015-02-24 |
| 8952832 | Interfacing application programs and motion sensors of a device | Joseph Jiang, David Sachs | 2015-02-10 |
| 8633049 | Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2014-01-21 |
| 8513747 | Integrated MEMS devices with controlled pressure environments by means of enclosed volumes | Kegang Huang, Martin Lim | 2013-08-20 |
| 8508039 | Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics | Goksen G. Yaralioglu | 2013-08-13 |
| 8462109 | Controlling and accessing content using motion processing on mobile devices | David Sachs | 2013-06-11 |
| 8384134 | MEMS device including an electrical interconnect through a substrate | Michael Julian Daneman, Martin Lim | 2013-02-26 |
| 8351773 | Motion sensing and processing on mobile devices | David Sachs | 2013-01-08 |
| 8350346 | Integrated MEMS devices with controlled pressure environments by means of enclosed volumes | Kegang Huang, Martin Lim | 2013-01-08 |
| 8250921 | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics | David Sachs, Babak Taheri | 2012-08-28 |
| 8170408 | Optical image stabilization in a digital still camera or handset | Mansur Kiadeh, Yuan Zheng, Shang-Hung Lin, Sheena Shi | 2012-05-01 |
| 8084332 | Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2011-12-27 |