Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340209 | Mixed impedance leads for die packages and method of making the same | Sean S. Cahill | 2019-07-02 |
| 9997489 | Coated bond wires for die packages and methods of manufacturing said coated bond wires | Sean S. Cahill | 2018-06-12 |
| 9960468 | Metalized molded plastic components for millimeter wave electronics and method for manufacture | Sean S. Cahill | 2018-05-01 |
| 9859188 | Heat isolation structures for high bandwidth interconnects | Sean S. Cahill | 2018-01-02 |
| 9824997 | Die package with low electromagnetic interference interconnection | Sean S. Cahill | 2017-11-21 |
| 9812420 | Die packaging with fully or partially fused dielectric leads | Sean S. Cahill | 2017-11-07 |
| 9711479 | Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same | Sean S. Cahill | 2017-07-18 |
| 9673137 | Electronic device having a lead with selectively modified electrical properties | Sean S. Cahill | 2017-06-06 |
| 9275961 | Low cost high frequency device package and methods | Sean S. Cahill | 2016-03-01 |
| 8839508 | Method of making a high frequency device package | Sean S. Cahill | 2014-09-23 |
| 8581113 | Low cost high frequency device package and methods | Sean S. Cahill | 2013-11-12 |