Issued Patents All Time
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8647930 | Wafer with recessed plug | Andrew Graham, Gary Yama | 2014-02-11 |
| 8580691 | Method of forming non-planar membranes using CMP | Andrew Graham, Gary Yama | 2013-11-12 |
| 8426289 | Wafer with spacer including horizontal member | Andrew Graham, Gary Yama | 2013-04-23 |
| 7862229 | Temperature-gradient cancelation technique and device | Alexander Dribinsky, Gregory P. Pucci, Yongyao Cai, Mathew Varghese | 2011-01-04 |
| 7005193 | Method of adding mass to MEMS structures | Andrew C. McNeil, Gary Li | 2006-02-28 |
| 6913941 | SOI polysilicon trench refill perimeter oxide anchor scheme | David J. Monk | 2005-07-05 |
| 6401536 | Acceleration sensor and method of manufacture | — | 2002-06-11 |
| 6373271 | Semiconductor wafer front side pressure testing system and method therefor | Todd F. Miller, Ronald P. Bieschke | 2002-04-16 |
| 6307298 | Actuator and method of manufacture | — | 2001-10-23 |
| 5951893 | Integrated circuit pad structure with high temperature heating element and method therefor | Gordon Bitko | 1999-09-14 |
| 5900530 | Method for testing pressure sensors | Andrew C. McNeil, Mark D. Summers | 1999-05-04 |
| 5646609 | Circuit and method for selecting a circuit module | — | 1997-07-08 |