Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9476779 | Sensor with an embedded thermistor for precise local temperature measurement | Andrew Graham, Ando Feyh | 2016-10-25 |
| 9469522 | Epi-poly etch stop for out of plane spacer defined electrode | Andrew Graham, Gary Yama | 2016-10-18 |
| 9423303 | MEMS infrared sensor including a plasmonic lens | Ashwin Samarao, Ando Feyh, Gary Yama, Fabian Purkl | 2016-08-23 |
| 9368658 | Serpentine IR sensor | Fabian Purkl, Gary Yama, Ando Feyh | 2016-06-14 |
| 9274005 | Device and method for increasing infrared absorption in MEMS bolometers | Ashwin Samarao | 2016-03-01 |
| 9255328 | Metamaterial and method for forming a metamaterial using atomic layer deposition | Fabian Purkl, John Provine, Gary Yama, Ando Feyh | 2016-02-09 |
| 9242850 | Out-of-plane spacer defined electrode | Andrew Graham, Gary Yama | 2016-01-26 |
| 9236522 | MEMS infrared sensor including a plasmonic lens | Ashwin Samarao, Ando Feyh, Fabian Purkl, Gary Yama | 2016-01-12 |
| 9236555 | Piezoelectric based MEMS structure | Po-Jui Chen, Ando Feyh | 2016-01-12 |
| 9199838 | Thermally shorted bolometer | Fabian Purkl, Ando Feyh, Bongsang Kim, Ashwin Samarao, Thomas Rocznik +1 more | 2015-12-01 |
| 9194882 | Inertial and pressure sensors on single chip | Ando Feyh | 2015-11-24 |
| 9187314 | Anisotropic conductor and method of fabrication thereof | Ando Feyh, Fabian Purkl, Ashwin Samarao, Gary Yama | 2015-11-17 |
| 9159637 | Electronic device with an interlocking mold package | Ando Feyh, Andrew Graham | 2015-10-13 |
| 9093594 | Multi-stack film bolometer | Ando Feyh, Po-Jui Chen, Fabian Purkl, Gary Yama | 2015-07-28 |
| 9073749 | Structured gap for a MEMS pressure sensor | Andrew Graham, Gary Yama | 2015-07-07 |
| 9064800 | Method of manufacturing a sensor device having a porous thin-film metal electrode | Ando Feyh, Fabian Purkl, Gary Yama, Ashwin Samarao | 2015-06-23 |
| 9064982 | Thin-film encapsulated infrared sensor | Fabian Purkl, Gary Yama, Ando Feyh, Andrew Graham, Ashwin Samarao | 2015-06-23 |
| 9034764 | Method of forming wide trenches using a sacrificial silicon slab | — | 2015-05-19 |
| 8933535 | Wafer with spacer including horizontal member | Andrew Graham, Gary Yama | 2015-01-13 |
| 8906730 | Method of forming membranes with modified stress characteristics | Andrew Graham, Gary Yama | 2014-12-09 |
| 8890283 | Wafer with recessed plug | Andrew Graham, Gary Yama | 2014-11-18 |
| 8878314 | MEMS package or sensor package with intra-cap electrical via and method thereof | Andrew Graham, Gary Yama | 2014-11-04 |
| 8749250 | Micromechanical component and manufacturing method for a micromechanical component | Jochen Reinmuth | 2014-06-10 |
| 8749000 | Pressure sensor with doped electrode | Andrew Graham | 2014-06-10 |
| 8673756 | Out-of-plane spacer defined electrode | Andrew Graham, Gary Yama | 2014-03-18 |