Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7479446 | Semiconductor device and method of manufacturing same | — | 2009-01-20 |
| 7371681 | Method of manufacturing a semiconductor device | — | 2008-05-13 |
| 7192871 | Semiconductor device with a line and method of fabrication thereof | Kenichi Mori | 2007-03-20 |
| 6975007 | Semiconductor device including a polysilicon, barrier structure, and tungsten layer electrode | — | 2005-12-13 |
| 6864183 | Method for manufacturing a semiconductor device | — | 2005-03-08 |
| 6657301 | Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same | Yasuhiro Kanda | 2003-12-02 |
| 6599820 | Method of producing a semiconductor device | Yasuhiro Kanda, Mitsuo Kimoto, Noboru Sekiguchi | 2003-07-29 |
| 6333259 | Semiconductor device and apparatus and method for manufacturing the same | Junko Izumitani | 2001-12-25 |
| 6329284 | Manufacturing process of a semiconductor device | — | 2001-12-11 |
| 6171957 | Manufacturing method of semiconductor device having high pressure reflow process | — | 2001-01-09 |
| 6002175 | Semiconductor device with improved connection hole for embedding an electrically conductive layer portion | — | 1999-12-14 |
| 5712140 | Method of manufacturing interconnection structure of a semiconductor device | Atsushi Ishii, Yoshifumi Takata, Akihiko Ohsaki | 1998-01-27 |
| 5565708 | Semiconductor device comprising composite barrier layer | Akihiko Ohsaki, Sumio Yamaguchi, Atsushi Ishii, Masahiko Fujisawa | 1996-10-15 |
| 5475267 | Multilayer interconnection structure for a semiconductor device | Atsushi Ishii, Yoshifumi Takata, Akihiko Ohsaki | 1995-12-12 |
| 5313100 | Multilayer interconnection structure for a semiconductor device | Atsushi Ishii, Yoshifumi Takata, Akihiko Ohsaki | 1994-05-17 |