Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240153 | Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product | Makoto Kawaguchi, Yoshikazu Muramatsu, Minoru Hanazato | 2025-03-04 |
| 12179395 | Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product | Makoto Kawaguchi, Yoshikazu Muramatsu, Minoru Hanazato | 2024-12-31 |
| 11784069 | Resin molding apparatus | Hirofumi Saito | 2023-10-10 |
| 11699604 | Resin molding apparatus | Hirofumi Saito | 2023-07-11 |
| 10475883 | Semiconductor device and method of manufacturing thereof | Masaru Kadoshima | 2019-11-12 |
| 9738014 | Resin molding machine | Tetsuya Maeyama, Hidemichi Kobayashi, Shusaku Tagami, Yoshikazu Muramatsu, Takayuki Yamazaki +6 more | 2017-08-22 |
| 9607956 | Semiconductor device and method of manufacturing the same | Masahiro Matsumoto, Kazuyoshi Maekawa | 2017-03-28 |
| 9406628 | Semiconductor device and method of manufacturing the same | Masahiro Matsumoto, Kazuyoshi Maekawa | 2016-08-02 |
| 9238314 | Method for resin molding and resin molding apparatus | Shusaku Tagami, Yoshikazu Muramatsu, Masanori Maekawa, Hideaki Nakazawa, Takuya Miyamoto | 2016-01-19 |
| 8169080 | Semiconductor device and method of manufacture thereof | Noboru Morimoto, Daisuke Kodama | 2012-05-01 |
| 7906848 | Semiconductor device | Yukihiro Kumagai, Hiroyuki Ohta, Naotaka Tanaka, Akihiko Ohsaki | 2011-03-15 |
| 7884011 | Semiconductor device and method of manufacture thereof | Noboru Morimoto, Daisuke Kodama | 2011-02-08 |
| 7714413 | Semiconductor device and method of manufacture thereof | Noboru Morimoto, Daisuke Kodama | 2010-05-11 |
| 6780769 | Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer | Akihiko Ohsaki, Noboru Morimoto | 2004-08-24 |
| 6716731 | Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate | — | 2004-04-06 |
| 6664641 | Wiring structure for an integrated circuit | Akihiko Ohsaki, Noboru Morimoto | 2003-12-16 |
| 6657265 | Semiconductor device and its manufacturing method | Kenichi Mori, Toshiaki Tsutsumi | 2003-12-02 |
| 6624516 | Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer | Akihiko Ohsaki, Noboru Morimoto | 2003-09-23 |
| 6593217 | Method of manufacturing semiconductor device | — | 2003-07-15 |
| 6472700 | Semiconductor device with isolation insulator, interlayer insulation film, and a sidewall coating film | Kazutoshi Wakao, Akinobu Teramoto | 2002-10-29 |
| 6236090 | Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate | — | 2001-05-22 |
| 5565708 | Semiconductor device comprising composite barrier layer | Akihiko Ohsaki, Sumio Yamaguchi, Atsushi Ishii, Kazuyoshi Maekawa | 1996-10-15 |