Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6589059 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 2003-07-08 |
| 6583035 | Semiconductor package with a controlled impedance bus and method of forming same | Nader Gamini | 2003-06-24 |
| 6545875 | Multiple channel modules and bus systems using same | Belgacem Haba, Sayeh Khalili | 2003-04-08 |
| 6530062 | Active impedance compensation | Haw-Jyh Liaw, Pak Shing Chau, Kevin S. Donnelly | 2003-03-04 |
| 6514794 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Sayeh Khalili | 2003-02-04 |
| 6504875 | Apparatus for multilevel signaling | John B. Dillon | 2003-01-07 |
| 6496889 | Chip-to-chip communication system using an ac-coupled bus and devices employed in same | Haw-Jyh Liaw, Alfredo Moncayo, Kevin S. Donnelly, Richard M. Barth, Bruno W. Garlepp | 2002-12-17 |
| 6447321 | Socket for coupling an integrated circuit package to a printed circuit board | John B. Dillon | 2002-09-10 |
| 6426984 | Apparatus and method for reducing clock signal phase skew in a master-slave system with multiple latent clock cycles | Haw-Jyh Liaw, Kevin S. Donnelly | 2002-07-30 |
| 6404660 | Semiconductor package with a controlled impedance bus and method of forming same | Nader Gamini | 2002-06-11 |
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Sayeh Khalili | 2002-04-23 |
| 6359931 | Apparatus and method for multilevel signaling | John B. Dillon | 2002-03-19 |
| 6352435 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 2002-03-05 |
| 6304104 | Method and apparatus for reducing worst case power | Craig E. Hampel | 2001-10-16 |
| 6287132 | Connector with staggered contact design | David Nguyen | 2001-09-11 |
| 6273759 | Multi-slot connector with integrated bus providing contact between adjacent modules | Nader Gamini | 2001-08-14 |
| 6266730 | High-frequency bus system | Billy Wayne Garrett, Jr., Haw-Jyh Liaw, David Nguyen, Srinivas Nimmagadda, James A. Gasbarro +1 more | 2001-07-24 |
| 6234820 | Method and apparatus for joining printed circuit boards | John B. Dillon | 2001-05-22 |
| 6160716 | Motherboard having one-between trace connections for connectors | David Nguyen | 2000-12-12 |
| 6067594 | High frequency bus system | Billy Wayne Garrett, Jr., Haw-Jyh Liaw, David Nguyen, Srinivas Nimmagadda, James A. Gasbarro +1 more | 2000-05-23 |
| 6007357 | Chip socket assembly and chip file assembly for semiconductor chips | Wayne S. Richardson, John B. Dillon | 1999-12-28 |
| 6005895 | Apparatus and method for multilevel signaling | John B. Dillon | 1999-12-21 |
| 6002589 | Integrated circuit package for coupling to a printed circuit board | John B. Dillon | 1999-12-14 |
| 5995016 | Method and apparatus for N choose M device selection | — | 1999-11-30 |
| 5908333 | Connector with integral transmission line bus | James A. Gasbarro, John B. Dillon | 1999-06-01 |